Standards for infrared
surveys of building envelopes, available to NAIS members, set minimum requirements for describing and reporting
conditions observed. Standards define and clarify terms, procedures, scope, conditions, and limitations as they
relate to an NAIS Infrared Survey and Report.
An infrared survey of a building envelope can be conducted for multiple reasons including energy loss due to inadequate
or damaged insulation, air infiltration, and deterioration due to moisture intrusion. The Infrared Survey Report
communicates the information to the client through visual and thermal images and written documentation.
A qualified thermographer
performs a non-invasive infrared survey of the readily accessible and applicable areas of the building envelope.
The accompanying Infrared Survey Report documents areas with abnormal surface temperatures requiring further investigation.
The Standards provide minimum guidelines for the survey, and outline what the thermographer should survey and report
on, but are not intended to limit the thermographer from exceeding the Standards.
Relationship to Other Standards. The referenced national and international Standards below have been used as a
normative guideline for the revised NAIS Standards for infrared surveys of building envelopes:
- ASTM C-1060: Standard
practice for Thermographic Inspection of insulation Installations in Envelope Cavities of Frame Buildings
- ISO 6781 Thermal insulation,
qualitative detection of thermal irregularities in building envelopes, Infrared Method
- American Society for
Nondestructive Testing (ASNT) SNTTC-1A, and ASNT CP-105-2011
- RESNET 2006 National
Mortgage Industry Home Energy Rating Systems Accreditation Standards, Chapter 8, RESNET Standard for Thermographic
- ASTM E 1186-03: Standard
Practices for Air Leakage Site Detection in Building Envelopes and Air Barrier Systems.
- IICRC S520 Standard
and Reference Guide for Mold Remediation
- Canadian General Standards
Board, Document 149-GP-2MP, Manual for
Thermographic Analysis of Building Enclosures.